• HUAWEI D15 DAH98MB38B0 - zdrapana soldermaska, jak wlutować RT1711?

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 [SOLVED] HUAWEI D15 DAH98MB38B0 - zdrapana soldermaska, jak wlutować RT1711?

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#1 HUAWEI D15 DAH98MB38B0 - zdrapana soldermaska, jak wlutować RT1711?

by poster • 26 April 2024, 13:43
DAH98MB38B0 rev B HF
CPU: SRGL0
KBC: IT8987VG

Wstyd się przyznać, ale podczas czyszczenia padów po wylucie układu zdrapałem nieco soldermaski.
Według tego co widać VCONN i INT_N są na jednej ścieżce. Pytanie: czy tak powinno być, czy może VCONN ma pozostać niepodłączony i należy widoczną ścieżkę zabezpieczyć soldermaską?

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Re: HUAWEI D15 DAH98MB38B0 - zdrapana soldermaska, jak wlutować RT1711?

by Google Adsense [BOT] • 26 April 2024, 13:43

#2 Re: HUAWEI D15 DAH98MB38B0 - zdrapana soldermaska, jak wlutować RT1711?  [SOLVED] 

by matic • 26 April 2024, 14:36
Hello!

The pad B1 (VCONN) must not be connected to the board, so protect the exposed copper trace with a solder mask.

#3 Re: HUAWEI D15 DAH98MB38B0 - zdrapana soldermaska, jak wlutować RT1711?

by poster • 29 April 2024, 09:47
Dziękuję za pomoc. Zabezpieczyłem ścieżkę, zdjąłem kulkę z pada B1 i wstawiłem układ. Płyta działa.

Re: HUAWEI D15 DAH98MB38B0 - zdrapana soldermaska, jak wlutować RT1711?

by Google Adsense [BOT] • 29 April 2024, 09:47
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